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New Equipment | Industrial Automation
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Industry News | 2011-09-23 22:31:43.0
Kyzen announces that Dr. Mike Bixenman will present “Compatibility of Cleaning Agents with Nano-Coated Stencils” at the upcoming SMTA International Conference & Exhibition
Industry News | 2019-11-27 01:33:15.0
ULT AG recently introduced the mobile soldering fume extraction unit LRA 160.1 for small and medium air pollutant quantities
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
| https://www.smtfactory.com/What-are-the-working-principles-and-usage-skills-of-Full-auto-SMT-Stencil-Printer-id3506468.html
, the requirements for Full-auto SMT Stencil Printer are very high, the solder paste release effect is good, the printing process is relatively stable, and it is suitable for the printing of fine-pitch components
| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx
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