Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Industry Directory | Equipment Dealer / Broker / Auctions
Qersa Technology Co., Ltd. is a high-tech enterprise that integrates scientific research, production, sales, and service. Our main business is to provide SMT Assembly Line Equipment, offering overall equipment solutions
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-s
Used SMT Equipment | SMT Equipment
Product name: YV100XG YAMAHA multi-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XG High speed and high precision multi-function modular placement machine 0.18 seconds/CHIP ul
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2024-06-20 22:53:23.0
A leading electronic hearing device manufacturer reduced UV precise coating cycle time by 79% with advanced automation. A manual process of hand brushing UV coating onto components was replaced by an automated solution from Nordson to increase production volumes, improve quality, and reduce costs for this complex application. Download the paper to learn the details of the application.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Events Calendar | Tue May 03 18:30:00 UTC 2022 - Tue May 03 18:30:00 UTC 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Providence, Rhode Island USA | Production
Manufacturing Supervisor for an electronic & electro-mechanical assembly, test, and packaging operation. ISO9001 company. Establish & maintain production schedules, improve efficiency & reduce cycle time, manage & develop staff.
Career Center | LaGrange, Ohio USA | Purchasing
JOB DESCRIPTION TITLE: Materials Manager DEPARTMENT:Materials SUPERVISOR:Vice President WORK HRS: 7.00 A.M. TO 3.30 P.M. DUTIES & RESPONSIBILITIES: Responsible for efficient, economical procurement and management of all raw materials
Career Center | Mendon, Massachusetts USA | Engineering,Management
Charles A. Mohn 42 Blackstone Street ~ Mendon, Massachusetts 01756 H: (508) 478-4136 camohn@comcast.net PROFILE Engineer ~ Manufacturing Results-oriented professional with broad-based manufacturing expertise that includes skill sets of engin
Career Center | New Delhi, India | Engineering,Research and Development,Technical Support
I have 2 Years experience in SMT,THT and BGA components and 3+ years experience in total. Currently,working in a CMMi LEVEL 5 enviornment. I have been Working on various Panasonic series machines and fuji components. My work profile involves : 1. Si
GPD Global | https://www.gpd-global.com/pdf/doc/Advanced-FPC-Real-Time-Controller-User-Guide-22940009.pdf
switch Operating temperatures . . . . . +10° C to +40° C (50° F to 104° F) 4 - Run Run is activated by operator or external/remote controller. Run controller (pg 16) 5 - Standby Standby time-out expires. Dot dispense window (pg 39) Continuous/Line dispense
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-base
I/O. The C-Flow is a revolutionary concept in intelligent pulsed heat controllers. It is an industry first, by combining precision temperature control with micron
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