Industry Directory | Manufacturer
The Future of Electronics is here - With Squink at your Desktop, print and assemble PCBs in minutes instead of weeks for less than a cup of coffee. Go from CAD design to PCB without the pain and cost.
The Profiling Machine for your Profile Machine The ProBot automatically verifies whether each PCB is processed to specification in the reflow oven. The suspect PCBs then can be sent off to batch X-ray. Because the typical batch X-ray machine only in
Fully automated IC Device Programmig System The largest device support in the industry Utilizes industrial personal computer (with control card inside). Built-in servo and vision system mode to quickly and accurately locate and complete chip cap
Electronics Forum | Tue May 05 18:37:08 EDT 2015 | visionbot
Hi! I am Alexandru and I am a maker. Right now I am trying to build VisionBot which is a Surface Mount Technology assembly shooter that can be used to place SMD chips onto Printed Circuit Boards for PCBA. Practically the Vision Bot machine will ena
Electronics Forum | Thu Aug 14 08:37:39 EDT 2003 | caldon
Jeff- I would start in the great state of Idaho. They are the largest producer of potatos in North America. http://www.idaho.com "Where you can be a spud". Unfortunatly that is the extent of my contribution. Hopefully it is enough to garner me a Pot
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2019-07-25 07:53:37.0
The Trump administration today is recognizing IPC member Calumet Electronics in Calumet, Michigan, for its efforts to expand its skilled workforce.
Industry News | 2020-07-27 11:12:23.0
Columbus, Ohio - Engineered Vision announces the release of the Flex-Bot: A New Generation of Vision Flex Feeding Technology! The Flex-Bot provides a solution to a previously unsolved manufacturing dilemma of high mix part feeding. This limitation has stifled manufacturers ability to automate, leaving manual labor in charge of dull and monotonous part feeding for anything less than ultra-high volume. The Flex-Bot offers an alternative to ultra-high volume single part bowl feeders with multiple part flexibility and additional orientation capability through robotic placement. With a standard hardware and software platform, there has been a greater than 40% reduction in engineering hours required to develop a custom application, and those savings are being passed on to the customer. With the ability to quickly adapt to an immense range of parts through Vibratory & Smart Auto-Tuning Technology as well as a point and click user interface, the Flex-Bot is the solution for today's current projects and tomorrow's ambitions.
Parts & Supplies | Pick and Place/Feeders
CABLE:LIGHT BARRIER Z-AXIS BOTTOM
Parts & Supplies | Pick and Place/Feeders
Extension cable BC-scanner bottom
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
A white board explanation of how KIC's automatic profiling works. Animation is in English.
-Pillar and BOT (Direct Bond on Substrate-Trace) Us
-Pillar and BOT (Direct Bond on Substrate-Trace) Us
Heller Industries Inc. | https://hellerindustries.com/parts/443560/
443560 - SPACER FOR FIREBAR,BOT,ENT,839.72MM,MK3.6 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Lewis & Clark | https://www.lewis-clark.com/product-tag/isys-opto-in-rev-2-0051-l2-bot/
ISYS Opto In Rev.2 0051 L2 BOT Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
