Industry Directory | Manufacturer
For Rapid PCB prototype deliveries (48 hours to 3 days), GSPK offer lead free HASL, IMMERSION SILVER or ENIG surface finishes. We can also committed to developing specialist PCBs i.e Ceramic and Heavy Copper PCBs
Industry Directory | Manufacturer
Since 1971, Eagle Electronics Inc. has provided our Customers with the highest quality Printed Circuit Boards at fair and competitive prices.
New Equipment | Solder Materials
http://www.flason-smt.com/product/Customizable-0-3-5-0mm-diameter-sn42bi58-lead-free-solder-wire.html Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire lead free solder wire sn42bi58 0.3-5.0mm diameter Customizable Product descri
New Equipment | Soldering - Other
http://www.flason-smt.com/product/Customizable-0-3-5-0mm-diameter-sn42bi58-lead-free-solder-wire.html Flason SMT Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire lead free solder wire sn42bi58 0.3-5.0mm diameter Customizable Prod
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications
| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
SN100C Lead-Free Bar Solder Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
Blackfox Training Institute, LLC | https://www.blackfox.com/should-you-use-lead-or-lead-free-solder/
? As its name suggests, lead-free solder is the complete opposite of its lead-based counterpart. Instead of lead, it contains other metals like copper, silver, indium, zinc, bismuth, antimony, tin, or nickel
