Industry Directory | Training Provider / Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
TMX caters to multiple markets with its EMS / SMT services. We can assist from design through to final logistics stages. Our Juarez location is ideal to ship to both North & South American markets.
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
The I.C.T X-7100 is a high-performance automatic offline X-ray inspection machine, designed for precise non-destructive testing (NDT) of SMT PCB assemblies, semiconductor components, and BGA/void detection. This system provides high-resolution X-ray
Used SMT Equipment | X-Ray Inspection
• Installed new in 2006 • Single Owner and used in a Lab Environment • Maintained by OEM and under OEM ASC, throughout original ownership • Currently offline and immediately available Tube Type: 160kv NF – Transmissive type (open tube ~ maintain
Used SMT Equipment | X-Ray Inspection
Nikon XTV130 Microfocus X-Ray System Make: Nikon / X-TEK Model: XT V 130 Year: 2011 Xray Source: 130kV 10W Nanotech TT Manipulator: 1.2kg 4 Axis Power Supply: 230V, 1PH, 50/60Hz, AC, 1500VA Hamamatsu Image Intensifier C7336-03 MOD X-Ray Source: Open
Industry News | 2003-03-20 09:03:05.0
Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-11-20 18:49:11.0
Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspection, not only provides a non-destructive test but also allows investigation within optically hidden areas, such as the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips). As the size of components continues to diminish, today's x-ray inspection systems must provide increased magnification, as well as better quality x-ray images to provide the necessary analytical information. This has led to a number of x-ray manufacturers offering digital x-ray inspection systems, either as standard or as an option, to satisfy these needs. This paper will review the capabilities that these digital x-ray systems offer compared to their analogue counterparts. There is also a discussion of the various types of digital x-ray systems that are available and how the use of different digital detectors influences the operational capabilities that such systems provide.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Career Center | South Windsor, Connecticut USA | Engineering,Technical Support
Posting JK-NVPE Process Engineer(PCB Assembly and support)- Our client, located in northern Connecticut, seeks a process engineer capable of providing engineering support in the development and/or improvement of current or new technologies and proces
Career Center | , | Engineering
Job description This position is for a Mechanical Engineer involved in supporting, developing, and improving microelectronics manufacturing processes to optimize Quality, On-Time Delivery, and Cost with an emphasis on Safety. Implementation of Lean M
Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support
Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model
Career Center | chennai, India | Production,Quality Control,Technical Support
Over 2 years of experience in PCBA Debug/Rework & Quality Control Process Analytical skills to follow logic of electronic circuit and interface with software's Experience in handling BGA, QFP IC,TQFP,DIP,SMD,Blower,Hot air gun, Solid understandi
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/bga-rework-station-model-zm-r7850as
BGA & SMD Rework Station - Model ZM-R7850A – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
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