Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.
New Equipment | Solder Paste Stencils
Product material: stainless steel (internal) + steel plate baking paint Storage quantity: 36 cans of tin paste Product weight: 13kg Product size: 495 * 750 * 95mm Application: SMT workshop solder paste storage control, first in, first out
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Technical Library | 2026-04-07 21:39:30.0
Field trials were conducted of wheat (Triticum aestivum) cv. Cadenza in which asparagine synthetase gene, TaASN2, had been knocked out, either on its own or together with a partial knockout of the related gene, TaASN1, using CRISPR/Cas9. Chemical mutagenesis (TILLING) TaASN2 nulls in the Claire background were also included. The main aim was to assess the free asparagine content of the grain and the conversion of free asparagine to acrylamide, a toxic contaminant, in bread, toast and biscuits. Over 2 years of trials combined, the TaASN2 and TaASN1/2 CRISPR knockouts resulted in a reduction of free asparagine in the grain of 59% and 93%, respectively, compared with Cadenza. The reduction in the TaASN2 total knockout TILLING line compared with Claire was 50%. Yield was not affected in the edited lines but was reduced in the TILLING lines. Acrylamide in bread made from a TaASN1/2 CRISPR line was below detection levels, while in a TaASN2 CRISPR line it was 14% of the Cadenza control. Even after 4min of toasting, acrylamide levels remained at 8% and 23%, respectively, of the control. The concentration in bread made from the TILLING TaASN2 knockout was 21% that for the Claire control, rising to 46% after 4min of toasting. Acrylamide in biscuits made from a TaASN1/2 CRISPR line was reduced by 93% compared with the control. The relationship between acrylamide and colour was altered in the edited and mutant lines compared with the controls, with less acrylamide forming for the same degree of colour.
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
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. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/mixers/in-line-plastic-mixers
. With housings made from heavy-walled stainless steel pipe, it resists dents and distortions. The mixer elements can be pushed out and replaced, making routine maintenance easier
