New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
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ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package TL431BQDBZR NXP 24AA025E48T-I/OT MICROCHIP 24LC16BT-I/OT MICROCHIP 24LC256-I/SN
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package TL431BQDBZR NXP 24AA025E48T-I/OT MICROCHIP 24LC16BT-I/OT MICROCHIP 24LC256-I/SN
ST New and Original STM32F407ZET6 in Stock LQFP-144 package ST New and Original STM32F407ZET6 in Stock LQFP-144 package ST New and Original STM32F407ZET6 in Stock LQFP-144 package TJA1040T/CM,118 NXP TJA1042TK/3/1J NXP TJA1043T,118 NXP TJA105
Hyland; Agilent Au over Ni on Cu is a widely used p
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company Directory Calendar Career
GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx
. Adjusted row spacing of misc cells to allow for different lengths of translated text and comments. 6. Removed the symbols for the metals on the standard smelter list (e.g., "Sn"). 7
