New Equipment | Board Handling - Conveyors
http://www.flason-smt.com/product/SMT-Assembly-line-Wave-soldering-machine-in-feed-conveyor.html SMT Assembly line Wave soldering machine in feed conveyor Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:App
Flason SMT Assembly line Wave soldering machine in feed conveyor Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg Product description: SMT Assembly line Wave soldering machine in feed conveyor
Industry News | 2013-08-01 13:16:42.0
The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX.
Industry News | 2009-10-26 10:41:55.0
Test Equipment Connection Opens New Affiliate
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
TI New and Original BQ24092DGQR in Stock MSOP-10 package TI New and Original BQ24092DGQR in Stock MSOP-10 package TI New and Original BQ24092DGQR in Stock MSOP-10 package KSZ8081MNXIA-TR MICROCHIP KSZ8081MNXIA MICROCHIP HV9910BLG-G MICROCHIP
ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package TL431BQDBZR NXP 24AA025E48T-I/OT MICROCHIP 24LC16BT-I/OT MICROCHIP 24LC256-I/SN
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/au-4-aux-unit-226536?page=3&order=list_price+asc
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