Industry Directory: application adoption (6)

Rapid PCB Engineering

Industry Directory | Consultant / Service Provider

An industry leader in high quality PCB Layout Design and PCB CAM Front End Engineering Services offering you the very best service at very competitive prices.

J.D. Edwards

Industry Directory |

J.D. Edwards is the leading provider of agile, collaborative solutions for the connected economy.

New SMT Equipment: application adoption (983)

Double Bonding Head Hot Bar Soldering Machine With Two Working Modules

Double Bonding Head Hot Bar Soldering Machine With Two Working Modules

New Equipment | Soldering Robots

Applications: 1. Adopt ACF technics to connect TAB/FPC onto TFT/ LCD. 2.  Adopt soft soldering technics to connect FPC,FFC onto PCB: Connect single core axes onto plugs. 3. Applied to seal LCD modules in cell phones, electronic translators, PDA,

ChuangWei Electronic Equipment Manufactory Ltd.

Distinguish Visual Robot Automatic Vision Laser Soldering Machine 2P 220V 50HZ

Distinguish Visual Robot Automatic Vision Laser Soldering Machine 2P 220V 50HZ

New Equipment | Soldering Robots

Special Features 1 .soldering product with lead or without lead, causing no pollution and saving tin for transiting tin with a certain quality No need to change tin wire 2.There is no need to add prefluxing, without full heating, low energy consump

ChuangWei Electronic Equipment Manufactory Ltd.

Used SMT Equipment: application adoption (25)

Juki FX-1

Juki FX-1

Used SMT Equipment | Pick and Place/Feeders

Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laseridentification chip ~20mm component or 26.5*11mm Component mounting spee

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki FX-1 JUKI chip mounter

Juki FX-1 JUKI chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: application adoption (380)

Stencils Optimise Paste Release

Industry News | 2003-03-21 08:12:24.0

Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.

SMTnet

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

Parts & Supplies: application adoption (80)

Technical Library: application adoption (11)

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2020-02-26 23:24:02.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2021-06-15 15:17:33.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

Videos: application adoption (143)

Methods to improve the speed of the SMT machine--KINGSUN

Videos

In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM MOMENTUM+/M201908

Videos

Model name CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ~ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn Co

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Training Courses: application adoption (2)

IPC-6012 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-6012 Trainer (CIT)

The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.

National Technical Systems

IPC J-STD-001 Trainer (CIT) Certification Training Course

Training Courses | | | IPC J-STD-001 Trainer (CIT)

The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.

PACE Worldwide

Events Calendar: application adoption (1)

Joint Chapter Meeting: Photonic Soldering

Events Calendar | Wed May 12 18:30:00 UTC 2021 - Wed May 12 18:30:00 UTC 2021 | ,

Joint Chapter Meeting: Photonic Soldering

Surface Mount Technology Association (SMTA)

Express Newsletter: application adoption (745)

Partner Websites: application adoption (48)

Drones: The Next Frontier for Printed Circuit Boards? | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/drones-the-next-frontier-for-printed-circuit-boards/

. The adoption of drones by a multitude of industries is making them a lucrative target as they are an emergent technology, far from mature

Imagineering, Inc.

Share Ownership Guidelines | Nordson Corporation

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/corporate-governance/share-ownership-guidelines

, within five years of the date of adoption. Likewise, newly elected or promoted executive officers will have up to five years to meet the applicable ownership requirements after their election or promotion, or in the case of executive officers

ASYMTEK Products | Nordson Electronics Solutions


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