Industry Directory | Research Institute / Laboratory / School
IMPACT lab is focused on cutting-edge research in innovative antenna designs, RF circuits, and sensors.
Antennas exist in all communication equipment and in a broad range of electronics. The industries that use antennas range from telecom to medical industry to military applications. Current antennas are much smaller than previous generations and, in m
New Equipment | Design Services
Our staff of senior level designers has extensive experience ranging from High Frequency RF, Large multi-processor, Power, Blind/Buried technology to ATE, Probe, Mix signal and beyond. At ACD the foundation of a good PCB starts with an emphasis on
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz HE300 Portable directional antenna for tracing signal transmitters and interference sources In conjunction with portable receivers (e.g. R&S PR100) the R&S HE300 is used for localizing transmitting and interfering sources. The d
Used SMT Equipment | General Purpose Test & Measurement
THE LEADING CABLE AND ANTENNA ANALYZER FOR WIRELESS PROFESSIONALS: Anritsu's Site Master cable and antenna analyzer is the preferred choice of service providers, network operators and contractors worldwide who install, deploy, maintain and troublesho
Industry News | 2003-03-14 09:03:48.0
Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Technical Library | 2020-08-13 00:59:03.0
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. The nature of additive manufacturing allows designers to create custom components and devices for specialized applications and provides an excellent and inexpensive way of prototyping electronic designs. The combination of multiple printable materials enables the vertical integration of conductive, dielectric, and semi-conductive materials which are the fundamental components of passive and active circuit elements such as inductors, capacitors, diodes, and transistors. Also, the on-demand manner of printing can eliminate the use of subtractive fabrication processes, which are necessary for conventional microfabrication processes such as photolithography, and drastically reduce the cost and material waste of fabrication.
Technical Library | 2016-11-23 00:26:50.0
As we wirelessly connect more and more devices to the Internet, electronics engineers face several challenges, including how to package a radio transmitter into their existing device real estate and how to make increasingly smaller devices. They’re also striving to meet consumer demand for Internet of Things (IoT) products that are ergonomically easy to use and unobtrusive to the environment. This whitepaper explores the challenges that come with designing connected devices into increasingly smaller products, specifically antenna integration, and how system-inpackage modules can help.
For more on HyperLynx: http://www.mentor.com/pcb/xpedition/simulation For more on HyperLynx and SerDes design: http://www.mentor.com/pcb/xpedition/simulate-si/serdes Try HyperLynx PI in the Cloud: http://www.mentor.com/products/pcb-system-design/pr
Applications: Thick film circuit, pressure sensor (piezoresistive, capacitive), glass glaze potentiometer, dielectric antenna, ceramic metallization RFID, automotive oil level sensor, LED ceramic bracket, tension sensor, piezoelectric ceramic comp
Events Calendar | Wed Jun 12 18:30:00 UTC 2024 - Wed Jun 12 18:30:00 UTC 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Littleton, Colorado USA | Engineering
If you have experience in Satellite Communications or RF Payload Engineering we have advancement opportunities that may be of interest to you. Available positions are in disciplines such as: Shaped Reflector design and analysis Antenna compo
Career Center | San Jose, CA, California USA | Engineering,Production,Research and Development
Senior PCB Designer: Want to be part of an exciting pre-IPO enterprise B2B company working on the cutting edge of internet-of-things, artificial intelligence & agents, blockchain, and manufacturing technology? This well-funded venture-backed co
Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto
SMTnet Express, November 23, 2016, Subscribers: 26,700, Companies: 15,023, Users: 41,441 Miniaturizing IoT Designs Tom Nordman, Pasi Rahikkala; Silicon Labs As we wirelessly connect more and more devices to the Internet, electronics engineers face
SMTnet Express, February 20, 2020, Subscribers: 34,176, Companies: 10,969, Users: 25,623 Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics Credits: Integrated Microwave Packaging Antennas and Circuits
| https://www.eptac.com/location/eptac-atlanta-metro-training-center?hsLang=en
cable assemblies, wire harnesses, electromechanical assemblies, and power distribution cable assemblies for OEMs, contract manufacturers, and engineering design companies
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-reduce-emi-in-printed-circuit-boards/
challenges of electromagnetic interference (EMI) during the design process. In all electronic components, EMI impacts the function of the device through radiation and induction, causing issues like feedback, static, and communication errors
