Industry Directory: aluminium (28)

Hitech Circuits Co., Limited

Hitech Circuits Co., Limited

Industry Directory | Manufacturer

Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.

Witgain Technology LTD.

Industry Directory | Manufacturer

Multilay,HDI,thick copper and Aluminium boards'supplier

New SMT Equipment: aluminium (313)

PCB Depaneling machine ASCEN-620 cutting machine for separating aluminium panel-FR4/CEM-1

PCB Depaneling machine ASCEN-620 cutting machine for separating aluminium panel-FR4/CEM-1

New Equipment | Depaneling

  ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com       For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde

ASCEN Technology

PCB Separator Machine Handling Long Hard FR4 / Aluminium Boards

PCB Separator Machine Handling Long Hard FR4 / Aluminium Boards

New Equipment | Depaneling

Use two horizontal knives to separate without stress and will not damage parts as close as 0.5mm from the score line and the operator cannot misfeed the board. PCB Separator Machine Handling Long Hard FR4 / Aluminium Boards Specifications Alumi

ChuangWei Electronic Equipment Manufactory Ltd.

Used SMT Equipment: aluminium (3)

Yamaha YCP10

Yamaha YCP10

Used SMT Equipment | Screen Printers

YCP10 High Performance Compact Printer - Vintage 2018,- Max PCB size: L 510 mm x W 460 mm- Stencil size: L 750 mm x W 750 mm (extensions needed for 23 square inches stencil)- YSP-3s head (Swing Single Squeegee): adjustable attack angle (from 45° to 6

TMI CONTROL PLUS

Ekra X5

Ekra X5

Used SMT Equipment | Screen Printers

Ekra   Type model – X5 Serial-Number – X5 01089 Alignment Repeatability -  +12.5 µm@6sigma Printing speed -  9mm/sec to 200mm/sec Printing pressure – 0kg to 26kg Frame size – 736mm*736mm*38mm Pr

Ekloo Bis

Industry News: aluminium (22)

Stannol Honored with 2025 Mexico Technology Award for Breakthrough in Aluminium Soldering

Industry News | 2025-09-24 19:14:30.0

Stannol, a leader in soldering technology, is pleased to announce that its ALU 1 Flux‑Cored Solder Wire has been awarded the prestigious 2025 Mexico Technology Award in the Solder – Bar and Cored Wire category. The award was presented during a ceremony held at SMTA Guadalajara 2025.

Stannol USA, LLC

Why do you need Stiffeners on Flex PCB?

Industry News | 2019-11-05 22:16:43.0

Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.

Headpcb

Parts & Supplies: aluminium (510)

Technical Library: aluminium (3)

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2023-11-14 19:24:08.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.

Vitronics Soltec

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2021-09-29 13:35:21.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.

Vitronics Soltec

Videos: aluminium (48)

PCB Depaneling machine ASCEN-620 cutting machine for separating aluminium panel-FR4/CEM-1

PCB Depaneling machine ASCEN-620 cutting machine for separating aluminium panel-FR4/CEM-1

Videos

http://www.pcb-separator.com/ Nutzentrennmaschine/Nutzentrenner/PCB depaneling machine ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4

ASCEN Technology

Nutzentrennmaschine/Nutzentrenner ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4

Nutzentrennmaschine/Nutzentrenner ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4

Videos

http://www.pcb-separator.com/ Nutzentrennmaschine/Nutzentrenner/PCB depaneling machine ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4

ASCEN Technology

Express Newsletter: aluminium (4)

Partner Websites: aluminium (654)

Aluminium Alloy SMT Feeder Trolley For Samsung SM Series Feeders

| https://www.feedersupplier.com/sale-13119306-aluminium-alloy-smt-feeder-trolley-for-samsung-sm-series-feeders.html

Aluminium Alloy SMT Feeder Trolley For Samsung SM Series Feeders Leave a Message We will call you back soon! Your message must be between 20-3,000 characters


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