Si-Al alloy with a CTE of 6.7ppm/C. This can be supplied as plate or block, or machined and plated to a finished component. Used in satellite microwave packages, avionics, PCIMs etc.
New Equipment | Industrial Automation
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Meeting Heat And CTE Challenges Of PCBs And ICs News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Meeting Heat And CTE Challenges Of PCBs And ICs The electronics industry
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
standard failure analysis techniques. A similar effect due to planar voiding was reported for mechanical reliability testing performed by Mukadam et al [10
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Process Engineer, Garmin AT 2012 Xian Qin , Georgia Institute of Technology Paper: "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections" Where is she now
