Industry Directory | Manufacturer
A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Screen Printers
Pressure Feedback, closed loop control Print Gap: 0 - 6mm Stencil Separation Speed: 0.1 - 20mm/sec Distance: 0 - 3mm Print Modes: ProFlow, Print Print, Print Flood, Flood Print, Adhesive Paste Knead: Programmable: Number, Period,
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Technical Library | 1999-04-15 06:54:01.0
High-speed printing techniques are revealed that break the speed barrier resulting from air entrapment in large apertures at fast squeegee speeds. Adhesive printability test results using conventional thickness stencils to achieve a significant range of d
Technical Library | 2021-08-11 00:55:44.0
In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Sun Sep 13 18:30:00 UTC 2020 - Sun Sep 13 18:30:00 UTC 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Sat Sep 26 18:30:00 UTC 2020 - Wed Sep 30 18:30:00 UTC 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | , | 2001-05-16 16:01:25.0
Work for an exciting young company with great funding. Your boss will be a highly respected SMTA director. Must have experience in all of the following: - adhesive dispensing - reflow - screen printing - cleaning Agencies: will split
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | , | Engineering,Management,Production,Sales/Marketing
Over 26 years experience in SMT manufacturing process, equipment, materials, production efficiency, quality. Solder Paste and Adhesive printing and deposition. Process and Training needs assessment. Sales and Engineering support for equipment, materi
Career Center | Leominster, Afghanistan | Engineering
3+ years of experience in SMT, through-hole and mixed technology, including screen printing and stencil design, adhesive dispensing, device placement and insertion, reflow and wave profiling, manual assembly, and AOI. Experience in DFM review. Stro
SMTnet Express, January 7, 2016, Subscribers: 23,975, Members: Companies: 14,885, Users: 39,703 Effect on Microwave Plasma Surface Treatment for Improved Adhesion Strenght of Direct Copper Plating on PTFE Akira Takeuchi, Takahiro Kurahashi
Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery
| https://www.feedersupplier.com/sale-13005432-dek-horizon-03ix-smt-stencil-printer-screen-printing-machine.html
DEK Horizon 03iX Smt Stencil Printer Screen Printing Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40355773-kxf0dxjba00-panasonic-cpk-double-sided-adhesive-for-smt-machines.html
KXF0DXJBA00 Panasonic CPK Double Sided Adhesive For SMT Machines Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
