widely adopted Sn-3.0Ag-0.5Cu solder alloys for
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
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: g/Min 4 bis 7 1 bis 3 8 bis 9 2 bis 7 1 bis 2 3 bis 6 0,4 bis 1,5 7 bis 9 1 bis 2 2 bis 5 Minimale Klebschicht: mm 0.0381 0.0508 0.0127 0.0127 0.0508 0.0254 0.1270 0.1270 0.0508 0.0127 Viskosität: 25 °C kCps 460 350 470 620 400 230 1400 1000 1000 460
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