Design and manufacture of electronic video overlay systems and stepper motor controllers
Wyles Hardy & Co. are consultant plant & machinery valuers & auctioneers specialising in the valuation and re-marketing of used equipment acting as agents on behalf of insolvency practitioners, financial institutions and private clients.
YAMAHA Refurbished YG100 Chip Mounter SMT Pick and Place Machine YAMAHA YG100 high-speed placement chip, high-precision, high-speed modular placement machine,high rigidity dual drive structure,High-performance servo system, high-resolution digital m
Refurbished Yamaha YV100 ll Pick and Place Machine Machine Type Automatic pick and place Brand Name Yamaha Machine Model YV100II Cycle Time Mix Comp. (Ideal) 0.198sec/chip CPH 12000 Ideal (
Used SMT Equipment | Pick and Place/Feeders
Siemens S15 / F3 SMT Feeder Table Item Location: Tampa, FL USA
Used SMT Equipment | Pick and Place/Feeders
Make: Juki Model: KE-2030 Features: OS: WIndows NT SW: 3.0.1.8 Chip Shooter Location: Camarillo, CA USA
Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-12-02 01:48:53.0
Some mechanical and assembly productions of existing companies of the Industry 3.0 and mechanical and assembly productions of perspective companies of the Industry 4.0 are described. The basic components of a smart factory and their interconnection to organize a production activity using humanless and paperless technologies are defined. A comparison analysis of parts and blanks movement to complete route sheet of the item manufacturing (radio and electronic item designing) in the companies of the Industry 3.0 and Industry 4.0 is given. The components of a digital item designing company to be created and implemented in the industry at first hand are defined.
University of Information Technologies, Mechanics and Optics [ITMO University]
PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc. The enlarged size is suitable for the sub-board processing of
PCB DEPANELING MACHINE ML-CS817/ML-CS818/ML-CS818A/ML-CS818L PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc
Events Calendar | Mon Apr 05 18:30:00 UTC 2021 - Mon Apr 05 18:30:00 UTC 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BS in Engineering(3.0 GPA or higher), 3+ years in manufacturing enviornment, good communication skills, must be able to work at multiple tasks, ability to look at Big Picture. Duties/Requirements: Provide engineering expertise fo
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSCS(GPA 3.0 or higher), 0-5 years experience in at least 1 of the following: Embedded Systems, PSost, Unix, C/C++, Pascal; knowledgeable of data structures, real-time operating systems, finite state systems, programming in a st
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8485733-suzuki-r2-nozzle-smt-nozzle-suzuki-2500-nozzle-r2-3-0.html
Suzuki R2 Nozzle SMT Nozzle SUZUKI 2500 NOZZLE R2 3.0 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.hitachi-feeder.com/sale-10605281-hitachi-fa04-nozzle-gxh-1-3-5-6301329253.html
(BA05) Round ￠2.0-3.0 3 BA06 KYB-M77A6-A0 ASSY_NOZZLE(BA06) Round ￠3.0-5.0 4 BF01 KYB-M77B1-A0 ASSY_NOZZLE(BF01) Round ￠3.0-8.0 5 BF02 KYB-M77B2-A0 ASSY_NOZZLE(BF02) Round ￠8.0
