Seamless steel pipe :OD 1/4 inch-30inch W.T 1.25mm to 50mm ERW steel pipe:OD 1/2inch-52inch W.T 1.65mm to 25mm LSAW steel pipe: OD 1/2inch-52inch W.T 1.65mm to 25mm Spirally welded steel pipe: 21
MDE Semiconductor, Inc. is a market leader in Circuit Protection Products.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
Used SMT Equipment | SMT Equipment
Product name: RX 7 high-speed module chip mounter Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, high quality new modular placement machine RX 7 listed Component placement speed (best con
Used SMT Equipment | SMT Equipment
Model:YV10011 Placement Speed: Chips :14400cph(0.25sec/chip) Placement Range:0402 chips ~25mm Placement Station:100 Power Supply:3P/200V-415V/3KVA Dimensions:1650X1358X1810mm Weight:1300kg
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Technical Library | 2007-01-03 16:36:58.0
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Career Center | , Texas USA | Sales/Marketing
The best money making opportunity in the SMT industry is now available in and around the Dallas Tx area. If you've got a desire to be a hunter and close big accounts - this is your E-Ticket. You'll have the opportunity to sell for a great company w
SMTnet Express, October 12, 2023, Subscribers: 25,126, Companies: 11,922, Users: 28,420 █ Electronics Manufacturing Technical Articles PCB design guidelines for MEMS sensors This technical note provides PCB design guidelines
| https://precision-pcb-services-inc.com/products/bga-rework-nozzle-for-the-srt-bga-rework-station-25mm-x-25mm
BGA Rework Nozzle for the SRT BGA Rework Station 25mm x 25mm – Precision PCB Services, Inc. Search Log in or Create account Cart
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/9498-396-02501-pm-backcover-magnet-25mm-210150?page=33&category=1112
ASSEMBLEON PM backcover magnet 25MM 9498 396 02501 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products ASSEMBLEON PM backcover magnet 25MM Public Pricelist Public
