http://www.flason-smt.com/product/Fuji-NXT-III-Pick-and-Place-Machine.html Fuji NXT III Pick and Place Machine Fuji NXT III Pick and Place Machine Patch speed: 22,500CPH H12S: 0402 ~ 7.5x7.5mm weight: 1,350kg Product description: Fuji NXT III
http://www.flason-smt.com/product/Fuji-NXT-III-Pick-and-Place-Machine.html Fuji NXT III Pick and Place Machine Fuji NXT III Pick and Place Machine Patch speed: 22,500CPH H12S: 0402 ~ 7.5x7.5mm weight: 1,350kg Product description: Fuji NXT III
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg if need more info about the products , pls don’t
Used SMT Equipment | SMT Equipment
Model :KE-760 Placement speed：Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg if need more info about the products , pls do
Industry News | 2020-12-10 14:12:04.0
High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability
Industry News | 2020-12-21 09:11:22.0
Several Ranges of Miniature Filters with Different Low-pass Configurations were designed to Protect Electronic Equipment from Interferences
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
SMTnet Express, September 3, 2015, Subscribers: 23,433, Members: Companies: 14,606, Users: 38,891 Embedded Fibers Enhance Nano-Scale Interconnections V. Desmaris, S. Shafiee, A. Saleem, A. Johansson and P. Marcoux; Smoltek AB While the density
 of.jpg)
 of1.jpg)
