Industry Directory | Manufacturer
professional manufacturer of pcb
Industry Directory | Manufacturer
PCB Global is a dedicated Prototype Quick Turn High Tech. PCB supplier - Quotes and orders can be processed 24/7/365 - free online quotation visit www.pcbglobal.com
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Features ●Suitable for high hardness aluminum, copper LED strip PCB. Two PCBAS can be separated at a time (ML-360B). ●Applicable PCB material:Aluminum,Copper,etc. ●Manually feding and precise positioning to separate PCBA. ●Progressive separation of f
Flason SMT China second hand Automatic Solder paste printer good quality Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China second hand Automatic Solder p
Used SMT Equipment | Depanelizers / Routers
Key Features Solution for stress free depanelization Fixture-based highly efficient dust vacuum system Clean and precise depanelization for densely populated PCBs Advanced image-processing software offers point-and-click operation fo
Used SMT Equipment | In-Circuit Testers
TAKAYA APT9411CE Needle count: the upper 4 (movable) under lateral 2 rings (not moving) Detection speed: the highest 0.08 ~ 0.08 SEC/step Repeated positioning accuracy within + - 50 um Tip the minimum test distance is about 0.2 mm Maximum size p
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Technical Library | 2026-03-17 20:51:50.0
The Tintina fault is a major ∼1,000‐km‐long geologic fault in the Yukon Territory of northwestern Canada, previously believed to have last been active around 40 million years ago, but speculated to remain capable of generating large earthquakes. Using new high‐resolution topographic data collected from satellites, airplanes, and drones, we have identified a 130‐km‐long segment of the fault where 2.6 million‐year‐old, and 132 thousand‐year‐old geological formations are laterally shifted across the fault by ∼1,000 and 75 m, respectively. From this, we surmise that the Tintina fault has ruptured in numerous large earthquakes in the recent geologic past, and continues to accumulate strain at an average rate of 0.2–0.8 mm/yr. We further show that the fault has not ruptured in a major earthquake for at least 12 thousand years, and could generate an earthquake of at least magnitude 7.5 in the future. The Tintina fault therefore represents an important, previously unrecognized, seismic hazard to the region.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Features ●Suitable for high hardness aluminum, copper LED strip PCB. Two PCBAS can be separated at a time (ML-360B). ●Applicable PCB material:Aluminum,Copper,etc. ●Manually feding and precise positioning to separate PCBA. ●Progressive separation of f
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| https://pcbasupplies.com/fuji-cp-4-nozzzle-0-8mm-x-12mm/
» SMT Standard Nozzles » Fuji » CP Series » CP-2, CP-3, CP-4, CP-5 » CP-4 Nozzles » FUJI CP-4 NOZZZLE 0.8MM X 12MM FUJI CP-4 NOZZZLE 0.8MM X 12MM
| https://precision-pcb-services-inc.com/products/bga-rework-station-model-zm-r7850as
: 400℃(Max) 11. Max PCB size: Max 640mm×520mm;Min10mm ×10mm 12. BGA chip size: 0.8mm×0.8mm—80mm×80mm 13. Size: L840mm×W960mm×H1600mm BGA Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy
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