New Equipment | Rework & Repair Equipment
Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp
I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us
Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon
Maybe something like this could work?
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Used SMT Equipment | Pick and Place/Feeders
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
Parts & Supplies | Chipshooters / Chip Mounters
Samsung SM481 Chip Mounter Focus on the way flight vision + fixed vision (optional) Number of axes 10 axes * 1 gantry Mounting Speed 0603 39000 (Best Conditions) Mounting accuracy chip ± 50um @ 3ó / chip, QFP ± 30um @ 3ó / chip Component Ra
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Shenzhen Zhuomao Technology Co., Ltd. Specialized in BGA/SMT Rework, Reballing, SMD LED (LED Display Module) Repair, TV LCD Laser Repair, X-Ray Inspection Machine Since 2005. We design and development of customized Non-standard BGA Rework System in
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
– MIDAS Component range Chip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd- shape, surface-mount connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) (1) Max: component weight: 140 g (2) (1) With 4K vision
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_beamworks_spark400.html
For accurate and controlled paste deposit Dispensing Capability Line dispensing: down to 0.4 mm (0.016”) pitch Dot dispensing: down to 0.3 mm (0.012”) in diameter Capability to dispense solder paste or epoxy dots and lines
