Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery
Industry Directory | Manufacturer
professional manufacturer of pcb
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
1 Year Warranty Pulse Heating Hot Bar Bonding Machine 0.25mm Pitch Technical parameters Model CWPC-1A Working area (mm) 200*260 Air pressing (MPa) 0.45~0.7
Used SMT Equipment | Pick and Place/Feeders
Panasonic CM301-D modular multifunctional placement machine The size of the parts that can be attached: from 0201 (0.25mm x 0.5mm) to 55mm x 55mm. Types of parts that can be loaded at one time: 120 kinds (8 mm tape). Mounting speed: 12,000
Used SMT Equipment | Pick and Place/Feeders
Description Make: Juki Model: RS-1 Year: 2018 Type: Placement Machine Details: The 2018 Juki RS-1 is a high-speed, modular pick-and-place machine designed for efficient and flexible production. It boasts a maximum speed of up to 4
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
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Technical Library | 2007-01-03 16:36:58.0
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
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| https://pcbasupplies.com/micro-fine-2/
: low to high Sort by price: high to low Thermaltronics M6MF375 Micro Fine 0.25mm (0.01″) $ 17.85 Add to cart Thermaltronics M6MF375H Micro Fine 0.25mm (0.01″), Power Plus
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_rounded-rectangle-pads_topic645.xml
. Rounded Rectangle pads : I see in the PCB Design Optimization... Author: chads108Subject: 645Posted: 30 Oct 2012 at 9:42amI see in the PCB Design Optimization presentation that recommended maximum radius for rounded rectangle pads is 0.25mm with a 0.01 round-off.
