Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery
Industry Directory | Manufacturer
professional manufacturer of pcb
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
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New Equipment | Solder Paste Stencils
DEK Horizon 03iX Fully Automatic Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type
Used SMT Equipment | Pick and Place/Feeders
Name:YV100II Placement Speed: 14400cph(0.25sec/chip) Placement Station:100 PCB Dimensions:330*250 Applicable elements:0402 chip ~25mm elements Accuracy:±0.1mm Power Supply:3 PH, 200-415V,3KVA Machine Dimensions:1650*1358*1810 Weight:1300kg
Used SMT Equipment | Pick and Place/Feeders
Name:YV100II Placement Speed: 14400cph(0.25sec/chip) Placement Station:100 PCB Dimensions:330*250 Applicable elements:0402 chip ~25mm elements Accuracy:±0.1mm Power Supply:3 PH, 200-415V,3KVA Machine Dimensions:1650*1358*1810 Weight:1300kg
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2010-07-10 08:36:16.0
Partners with MRC to bring high quality stencils quickly and with an accent on service
Technical Library | 2007-01-03 16:36:58.0
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
DEK Horizon 03iX Fully Automatic Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type
Career Center | , California USA | Engineering,Production,Research and Development
Take your knowledge of the Contract Electronics Manufacturing industry and experience working with various SMT equipoment and join one the leaders in development. We're currently searching for a senior level manufacturing engineer or manager to help
| https://pcbasupplies.com/mirae-type-0603-id-o-0-25-od-o-0-5-21003-61290-000/
XDry Corp Menu 0 Contact Us » Pick & Place Nozzles » SMT Standard Nozzles » Mirae » MIRAE: Type: 0603, ID : 0.25, OD : 0.5 [21003-61290-000] MIRAE: Type: 0603, ID : 0.25, OD : 0.5 [21003-61290-000] $ 125.00 Purchase this product now and earn 13 Points
| http://etasmt.com/cc?pageID=newsList&ID=te_news,0&pNum=25
... Show Details Total number: 256 Pages: 25 of 43 First Previous Next Last SMT Technical How many PCB classifications are there
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