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Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications The silver end termination plays an important role

SMTnet Express - June 16, 2022

SMT Express, Volume 5, Issue No. 1 - from SMTnet.com

Bohai Electronics Week 2006

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

SMTnet Express - July 15, 2021

SMTnet Express - Septemeber 1, 2016

SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305

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