Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Industry News | 2001-12-19 10:50:53.0
IPC has announced that Tom Newton has been named director of PWB Standards and Technology. In this position, Newton is responsible for new and existing standards in the areas of base materials and fabrication of printed circuit boards, as well as maintaining IPC involvement in new technologies in these same fields.
Surface Mount Technology Association (SMTA)
Industry News | 2003-04-24 08:16:54.0
http://www.smta.org/news/smta_calendar/calendar.cfm
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2011-02-26 16:00:45.0
Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor
Industry News | 2023-11-13 12:31:47.0
Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.
Industry News | 2009-09-17 14:59:53.0
TORRANCE, CA — September 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight Sayaka’s Table-Top Router, Hirox’s 3-D Microscope and the McDry MB-302 Low Temp Baking Cabinet in booth 617 at the upcoming SMTA International exhibition and conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
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