Industry News: hydrogen embrittlement gold solder (Page 1 of 1)

Hentec Industries/RPS Publishes an Engineer's Guide to Component Re-Conditioning Process

Industry News | 2021-04-13 17:37:07.0

Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.

Hentec Industries, Inc. (RPS Automation)

Hentec Industries/RPS Publishes Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Industry News | 2021-07-26 17:33:25.0

High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.

Hentec Industries, Inc. (RPS Automation)

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

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