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How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

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The Branford Group

A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.

Manufacturer / Equipment Dealer / Broker / Auctions

896 Main Street
Branford, CT USA

Phone: 203-488-7020

Training online, at your facility, or at one of our worldwide training centers"

High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...

High Precision Fluid Dispensers

World's Best Reflow Oven Customizable for Unique Applications

Lewis and Clark, Inc. is the #1 provider of pre-owned Surface Mount and In-Circuit Test equipment.