Industry News: class 3 vs class 2 (Page 1 of 69)

i4.0 Connect Forum - Fremont Marriott Silicon Valley

Industry News | 2019-09-12 22:51:52.0

Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.

Heller Industries Inc.

New Hands On Class for Wire/Cable Assembly

Industry News | 2016-09-01 12:07:57.0

A new class has been developed to teach EMS providers and others the basics of wire harness assembly techniques. This class goes along with the popular IPC-A-620 Wire and Cable Harness Assembly Acceptance standards.

BEST Inc.

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

AutoTRAX EDA Ltd. Appoints John Shotsky, Former Orcad Product Manager, as EDA Tools Product Manager

Industry News | 2003-02-04 08:49:40.0

John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001

SMTnet

AsusTeK Selects Cadence SPECCTRAQuest For High-Speed PCB System Development

Industry News | 2003-05-21 09:03:19.0

Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs

SMTnet

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

IPC Issues Call for Participation for High Reliability Forum

Industry News | 2023-04-17 08:38:56.0

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

Third Session of the High-Rel Cleaning & Conformal Coating Conference to Focus on Conformal Coating for Class 2 and 3 Electronic Assemblies

Industry News | 2016-09-29 20:17:32.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

Count On Tools Introduces Ceramic Nozzles for UIC’s Placement Equipment

Industry News | 2011-01-28 17:29:19.0

Count On Tools Inc. introduces new Ceramic Nozzle Series for the complete line of Universal Instruments Corporation’s (UIC) pick-and-place machines, including Genesis, Advantis, Flexjet and GSM.

Count On Tools, Inc.

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Three Speakers

Industry News | 2008-09-21 01:46:38.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Joe Russeau (Session Chair) of Precision Analytical Laboratory, Dr. Bev Christian of Research in Motion, Dave Hillman of Rockwell Collins, Matt Kehoe of Sipad Systems, and Doug Schueller of AbleConn will present during Session 3 on Building to Customer Reliability Standards in Class 2 and Class 3. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Association Connecting Electronics Industries (IPC)

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