Industry News: baking out (Page 1 of 2)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Typical RoHS Issues in PCB Assembly

Industry News | 2018-10-18 10:23:07.0

Typical RoHS Issues in PCB Assembly

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Seika Machinery, Inc. to Debut New McDry Products and Features at IPC APEX EXPO

Industry News | 2011-02-14 14:41:46.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut new products and features from McDry in Booth #459 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Seika Machinery, Inc.

Indium Corporation Features Heat-Spring® for LED Manufacturing at Strategies in Light

Industry News | 2016-02-11 22:57:15.0

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.

Indium Corporation

Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan

Industry News | 2024-01-29 11:33:44.0

Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Indium Corporation

Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

Industry News | 2024-01-29 11:36:51.0

Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.

Indium Corporation

Seika Offers McDry Cabinets with Data Loggers

Industry News | 2022-10-28 05:42:37.0

Seika Machinery, Inc. is pleased to offer McDry cabinets with Data Loggers as an option. Secure, cloud-based data storage, and multiple unit monitoring are just a few features of the Data Loggers.

Seika Machinery, Inc.

Get Ready for SMTAI with Seika Machinery

Industry News | 2021-10-31 05:01:48.0

Seika Machinery, Inc. is excited to announce its participation in multiple committees during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Seika will have leading equipment on display, in addition to participating in the MSD Council Meeting and Women's Leadership Program.

Seika Machinery, Inc.

Knowledge about PCB Panelization

Industry News | 2019-11-05 22:24:42.0

Designing a PCB for automatic assembly and full production runs requires a few design changes from an initial prototype PCB run. Today most PCBs are assembled and tested with automated machines from the data from PCB drawing files. With up to 80% of a new product's cost determined by the first prototype build, avoiding late changes and designing with manufacturing in mind can have a significant impact on the product cost, reliability, and yield of a PCB design. Luckily, if some good choices are made early in the design process, designing a PCB for manufacturing is relatively straight forward with few pitfalls.

Headpcb

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