Industry News | 2024-09-23 20:38:15.0
SMTXTRA is excited to announce its participation in SMTA International 2024, taking place from Oct. 22-24, 2024, at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees can visit SMTXTRA at Booth 2825 to explore its cutting-edge repair, maintenance, and servicing solutions.
Industry News | 2008-07-08 21:53:08.0
IPC APEX EXPO is the world's premier conference & exhibition for the electronic interconnect industry, developed and presented by the industry for the industry. Be a leader in printed board manufacturing or design, electronics assembly, manufacturing or test. Submit an abstract or course proposal today!
Industry News | 2020-07-22 04:56:05.0
IPC has extended the deadline for IPC APEX EXPO 2021 technical conference abstracts to Monday, August 31. Due to travel restrictions by some companies and geopolitical areas, IPC is also accepting proposals for virtual presentations. IPC APEX EXPO 2021 technical conference will take place January 26–28 and professional development courses will run January 23–28.
Industry News | 2011-05-03 22:58:11.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2012 IPC APEX EXPO™ at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 28–March 1, 2012, and the professional development courses will be February 26–27 and March 1, 2012.
Industry News | 2010-09-30 00:57:45.0
IPC — Association Connecting Electronics Industries® invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit poster abstracts for the academic poster competition at IPC APEX EXPO™, the industry’s premier conference on electronics manufacturing, April 12–14, 2011, in Las Vegas.
Industry News | 2011-10-03 15:19:17.0
IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
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