| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
. The second is the application of solder alloys with different melting points. The alloy with a higher melting point is used for the first side and the alloy with a lower melting point is used for the second side
| https://unisoft-cim.com/manual-pronto-detail_mount-file-window.htm
. This name is only inserted in the header section of the output file created and only if the header requires one. REFERENCE POINT 1: The Reference #1 point normally sets the 0,0 for machine output files generated by the Unisoft software
| http://etasmt.com/te_news_bulletin/2020-03-28/14961.chtml
. The second is the application of solder alloys with different melting points. The alloy with a higher melting point is used for the first side and the alloy with a lower melting point is used for the second side
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| https://unisoft-cim.com/fiducial-lineup-reference-points.html
be the XY origin 0,0 for the PCB. So for example, if you set the Reference 1 point on the top side of the PCB to be a fiducial point in the lower left corner of the PCB and that point is not currently the 0,0 XY origin for the PCB
| https://unisoft-cim.com/place_download.htm
1, the cursor will turn into a diamond. In the LEFT side pane move the cursor to the lower right of the assembly. Now place the cursor over a pin and click. The pin will turn to a diamond with the number 1 inside it (note that the REFERENCE 1 point
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| https://www.eptac.com/the-5-essential-tools-for-soldering/
. Keep in mind that the solder should have a lower melting point than the materials that are being joined. This will allow the solder to melt first and bond the materials together
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/dispensing-fluids-general?con=t&page=36
. Highlighted fluid dispensing solutions include: Nordson ASYMTEK : Automated industrial fluid dispensing systems for high speed, lower material volume applications in electronics manufacturing and other high-tech industries. Nordson EFD
