Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083
The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m
Electronics Forum | Mon Nov 10 08:53:23 EST 2014 | jpal
We have the opportunity to buy a new selective solder machine and are used to using a very old Jade machine with a moving tank and wetted nozzle. I have two process concept questions: Which is better- move the board over the nozzle or move the nozz
Electronics Forum | Mon Nov 10 09:03:47 EST 2014 | rgduval
I can't claim to be an expert....I've just bought a used RPS, and it'll be my first...but, after reading through their manual, and working on setting things up, I'd say: -Conceptually, I like the idea of moving the board rather than moving the entir
Electronics Forum | Tue Feb 03 13:39:08 EST 2009 | grics
Good morning Jamie. I work at a CM and can offer some input on process flexability. I do not have any data on how reliable the coating is but I can say that they are both very difficult to control. Will you be selective coating or full coating? Ho
Electronics Forum | Fri Feb 24 19:22:58 EST 2023 | SMTA-71549289
From my understanding titanium is typically used for non-wetting nozzles, correct? And then wetting nozzles are made of other metals with a coating that allows it to wet.
Electronics Forum | Thu May 19 17:03:11 EDT 2005 | splice1
Hi all, There are no ground layers which makes the non wetting rate a bit confounding. The foam fluxer has not been cleaned in a while though, while there is a strong evidence of fluxing by running blank paper and looking up the top side
Electronics Forum | Wed Oct 28 15:34:45 EST 1998 | carlm
| Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | That information should be contained in the technical data sheets supplied by
Electronics Forum | Wed Apr 06 15:28:04 EDT 2005 | patrickbruneel
Soldering PTH in reflow makes the process a lot more dependent on the physical forces in soldering (capillary force vs. gravity). Reducing the topheat in your oven will help the capillary forces (opening the hood solved the problem). Heat rises so if
Electronics Forum | Fri May 11 10:30:26 EDT 2001 | rkevin
I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be different? Solderpaste considerations? Anything else? In the past I have experienced selective non
Electronics Forum | Tue Jul 26 23:02:22 EDT 2005 | crishan
Hello, We currently have huge quality issues with our Inertec selective solder machine, the model we have does not pump solder, rather the solder bath is raised to the product. We have continuing issues with bridging and non wetting of joints. We a
