Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Mon Mar 04 11:08:56 EST 2002 | Matt Kehoe
We have a customer that desires to have their via holes plugged with solder after assembly. Is it possible to add the via holes to the stencil and print paste into them and expect them to plug? If so, how much paste? One to one on the stencil opening
Electronics Forum | Tue Mar 05 22:34:27 EST 2002 | YoYo
You better be careful how you plug vias at screenprint - we currently have a customer that wants vias plugged, so we had a 2% aperature reduction so we would not have to much paste, I believe it should have been reduced more because some of the solde
Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef
SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall
| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Wed Dec 18 10:10:07 EST 2002 | davef
No, sorry not on "Dave's Bookshelf". My basis is a study done at IBM. I reference it here: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4941&#Message19050 Responding differently, you're correct. If you have a
