Electronics Forum: components (Page 17 of 1140)

Brownish Tint on 0805 components

Electronics Forum | Mon Jul 19 16:03:39 EDT 2010 | warwolf

Agreed, on some components we have seen a "brownish tint" after reflow it doesn’t happen on all of our resistors it only appears to be on the leads, and have also seen the purpleish tint on some other 2512 components

Baking MSL components in vacuum.

Electronics Forum | Wed Jan 03 01:51:23 EST 2018 | grek

Hello, i would like to ask if there is any differencies when baking components in baker with control huminidity 5% or when baking components in vacuum? is it ok ? or it should not be baked in vacuum? And one more question: Is it possible to bake tr

Re: handling components for rework

Electronics Forum | Mon Jul 26 18:03:45 EDT 1999 | John Thorup

| We only do rework with SMT components or a small amount of SMT work. We are having a hard time keeping the components safe throughout the handling process of removing one or two components, and issuing them to an operator for processing or inspect

Drop components in Secon reflow

Electronics Forum | Thu Aug 25 20:00:31 EDT 2005 | Dave

Try Heller Industrie's website at http://www.hellerindustries.com They have a formula that they offer for free that calculates land pad geometry to component weight to prevent drop off of components during second reflow. If you can't find it, give t

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla

We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n

Brownish Tint on 0805 components

Electronics Forum | Wed Jul 14 12:33:54 EDT 2010 | vetteboy86

This has come up in the past, but I am ready to find an answer. A collegue immediately chalked it up to overheating the components. A check of that found otherwise. Not to mention it isn't all of them. For instance all the 104's 514's and 224's have

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 11 22:50:57 EDT 2017 | heros_electronics

Anyone who knows how to prevent such flaw? Tombstones are those lifted components from one sides. This results in costly and time-consuming amounts of touch-up and re-work after the assembly is completed. For the customers, this extra work translate

Quad 4c not placing components

Electronics Forum | Wed Sep 04 13:40:46 EDT 2019 | smrsteve

Hello DWL, Thanks for the response. I've measured the components with a micrometer and set the sizes. Maximum tolerance on my machine is 20%, and that's what I'm using. If I do a manual scan, the measurements are exactly right (and what I've set up

smt components vs. wave solder

Electronics Forum | Fri Nov 08 18:36:31 EST 2002 | leeloo

Nowadays I have a problem, I am in chsrge of the section of smt in my company, have a normal process inside my department with a minimal level of mistakes, the problem happens when the material is liberated to the lines of production on happened for

Baking components at 70 degree

Electronics Forum | gersla |

Wed Dec 19 14:01:24 EST 2007


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