Electronics Forum | Mon Jun 20 04:21:04 EDT 2005 | alex
What is the ideal component edge to board scored edge clearance?
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
Electronics Forum | Tue Apr 23 14:30:35 EDT 2019 | scotceltic
I would like to setup a guideline for BGA to components around it minimum distance. To allow for rework possibilities of the BGA. What are people using as a minimum clearance out there ?
Electronics Forum | Thu Apr 25 17:17:44 EDT 2019 | spitkis2
Years ago it was common to see 2-3mm keep out areas around BGAs. Now with boards being so densely populated there are no clearance minimums. Regardless if the machine is using convection or IR heating, parts can be reworked without affecting adjace
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Thu Feb 04 06:50:35 EST 1999 | Greg Flynn
What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ?
Electronics Forum | Thu Feb 04 09:09:11 EST 1999 | Peet
| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | We use 50% for civile application, and 25% for mil
Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.
| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off
