New SMT Equipment: ionic contamination acceptable level inductry leades (Page 1 of 2)

SMT Ionic Contamination Tester CTM-100

SMT Ionic Contamination Tester CTM-100

New Equipment | Cleaning Equipment

SMT Ionic Contamination Tester CTM-100 Test Method Static Sensitivity 0.001uS/cm Tank Size(mm) 380 x 300x 50 Weight (Kg) 42 Product description: SMT Ionic Contamination Tester CTM-100, Test Method Static, Sensitivity 0.001uS/cm, Tank Size(mm)

Flason Electronic Co.,limited

SMT Fixture Cleaning Machine SME-5200

SMT Fixture Cleaning Machine SME-5200

New Equipment | Cleaning Equipment

SMT Fixture Cleaning Machine SME-5200 Cleaning basket size Φ1000mm x H 200mm Clean tank capacity 80L Dry time 10~20Min Machine weight 500KG Product description: SMT Fixture Cleaning Machine SME-5200, Cleaning basket size Φ1000mm x H 2

Flason Electronic Co.,limited

SMT Fixture Cleaning Machine SME-5200

SMT Fixture Cleaning Machine SME-5200

New Equipment | Cleaning Equipment

SMT Fixture Cleaning Machine SME-5200 Cleaning basket size Φ1000mm x H 200mm Clean tank capacity 80L Dry time 10~20Min Machine weight 500KG Product description: SMT Fixture Cleaning Machine SME-5200, Cleaning basket size Φ1000mm x H 2

Flason Electronic Co.,limited

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

New Equipment | Cleaning Agents

IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues

KYZEN Corporation

C3 Critical Cleanliness Control

C3 Critical Cleanliness Control

New Equipment | Test Equipment

Localized Electronics Cleanliness Tester and Residue Extractor The information gathered when using the C3 is intended to provide a measure of the cleanliness of a localized region of a circuit board. In addition, the C3 extracts a sample of the effl

UM Technology Co., Ltd.

Selective Soldering System-H

New Equipment | Selective Soldering

Selective Soldering System-H Specifications: MODEL HPS 4/46 HPS 4/35S Equipment parameters Dimension(L×W×H) 2450x1845x1565 (mm) 2450 x 2055 x 1665 (mm)

Samtronik International Limited

Selective Soldering System-C

Selective Soldering System-C

New Equipment | Selective Soldering

  Categories Selective Soldering machine Album View larger image Brand SAMTRONIK Model System-C Dimension(L×W×H) 2700x1735x1415 (mm) Conveyor height 900±

Samtronik International Limited

Selective Soldering System-M

New Equipment | Selective Soldering

Categories Selective Soldering machine Album View larger image Brand SAMTRONIK Model System-M Dimension(L×W×H) 950 x 1776 x 1565/1700 x 1776 x 1565 (mm) Conveyor height 900&pl

Samtronik International Limited

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

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