Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
New Equipment | Solder Paste Stencils
Semi Auto SMT PCB Solder Paste Printing Machine Model 500mm 800mm 1200mm 1500mm Direction Left → Right, Right → Left Power Single phase 220V, 50/60Hz,100W Translational speed 0-2200mm/mins
I.C.T-4034 | PCB Printer Solder Paste Support Frameless Stencil Printer PCB Printer Solder Paste Support Frameless Stencil Printer I.C.T Full-auto SMT Stencil Printer is a high precision automatic solder paste printer, correspond to industrial 4.0 a
ASCEN GS700 is a high accuracy auto pcb screen printer designed for high precision screen printing or SMT stencil printing in SMT industry. Features: Independent, direct driven motor scraper. Built-in accurate pressure control
High Speed full-auto screen printing machine SMT Automatic Visible PCB Screen Printer For PCB Product Line. ASCEN PCB solder paste printer Support glue printing, automatic control improves production efficiency, quality control and saves pr
High Speed PCB solder paste printer SMT Automatic Visible PCB Screen Printing machine for PCB Product Line. ASCEN PCB solder paste printer Support glue printing, automatic control improves production efficiency, quality control and saves pr
Flason SMT Screen Printer Dimension: 880*780*1630mm Power: AC220V 50Hz /AC110v 60Hz Weight: 290KG Application Area: PCB, PCBA,SMT,LED Product description: SMT Screen Printer-Good Price Good Quality Good Service INQUIRY SMT Scre
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
ASCEN Automatic stencil printer greatly improve its accuracy and performance. Now the design of the circuit substrate is fine and small.Most electronic product manufacturers in the market are switching to automatic or fully automatic solder past
