New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Laser depanelization services from BEST Inc. feature precision cutting and depanelization cut out of flex and rigid flex materials. These materials a combination of Katon(TM), copper and rigid board material. After sending us the GERBER and cut out
BEST Inc. has been providing laser machined parts for the electronics industry for many years with both Kapton(TM) as well as as adhesive-backed Kapton (TM) shapes per customer requirements. These parts are being used as heat shields, spacers and mor
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Solder Paste Stencils
SMT Prototype Stencils are laser cut solder paste prototype stencils designed to work on their own for hand printing. These laser cut prototype stencils do not need to be permanently glued in a frame. These so-called framelessstencils are less expens
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Education/Training
The IPC J-STD-001 Training for the instructor is a class on the necessities for Soldered Electrical and Electronic Assemblies is a universal standard with wide acceptance on the assembly of printed circuit boards. The IPC J-STD-001 Training explains
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Standard : up 8 down 8 air furnace, patented hot air management system to make hot air convection more efficient heat capture faster; Dimension (L * W * H) 4800*1280*1420 Number of heating zones Up / Down 8 Number of cooling zones Up 2 Emission requ
