Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
Industry Directory | Consultant / Service Provider / Manufacturer
The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.
New Equipment | Cleaning Equipment
SMT PCBA In-line Cleaning Machine SME-6200 PCB width 50~600mm Conveyor net speed 100~1500mm/min Clean tank 300L Machine weight 2000KG Product description: SMT PCBA In-line Cleaning Machine SME-6200, PCB width 50~600mm, Conveyor net speed 100~
New Equipment | Cleaning Equipment
SMT PCBA In-line Cleaning Machine SME-6200 PCB width 50~600mm Conveyor net speed 100~1500mm/min Clean tank 300L Machine weight 2000KG Product description: SMT PCBA In-line Cleaning Machine SME-6200, PCB width 50~600mm, Conveyor net speed 100~
Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Our Global Sales Manager Dirk Schade introduces the Condor Sigma Lite at SMT/Hybrid/Packaging 2013 in Nürnberg, Germany. A bond tester that can grow with your company. Put it to the test! For more information, go to www.xyztec.com https://www.xyztec
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Sto. Tomas, Batangas, Philippines | Engineering
SKILLS & EXPERIENCES A.Materials engineering and management 1.Handles matters about materials -Ceramic and laminate substrates & Surface Mount Devices (SMDs) i.e. chip capacitors and resistors -Perishable materials i.e. solder paste (including Pb-fr
Career Center | Toronto,, Ontario Canada | Engineering,Research and Development
DEBTANU BASU 40 Fountain Head Road Toronto, ON M3J2V1 (416) 514 0619 Cell: 416 258 7488 E-mail: debtanubasu@aol.com With more than six years of experience in the field of flip chip technologies seeking a challenging technical position in the field
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
Dage-series 4000 shear tester. Table 3 shows the parameters of the shear test machine. Note that the shear force depends on shear speed (Newman, 2005). Each board was cut into two identical pieces. The first half of the board stands for the initial time
Baja Bid | https://bajabid.com/baja-bid-online-auction-june-3-5-2014-featuring-items-onechip-photonics-press-release-2/
• Dage 4000 Wire Bond Shear / Pull Tester • Ando AQ6317C Spectrum Analyzer • Loomis LSD-100 Scriber / Cleaver • Tektronix CSA 8000 Signal Analyzer
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