Capabilities include: 1 to 20 layers, adhesive based or adhesiveless, 3 mil traces and spaces, 6 mil drilled holes, available in 3 days to 20 days
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
New Equipment | Fabrication Services
Minimum line width/space: 5mils Surface finish: OSP Board thickness: 1.60MM Minimum drilled hole diameter: 10mils Copper thickness: 0.5oz
Wafer-level Product In-line(Ireland) 2D, 3D CT AXI Machine Automatic inspection equipment exclusively for the Wafer-level products and ultra-fine defects of mm can be detected using the Nano Tube of Class Focal spot 200nm. 2D, as well as 70&o
Up to 30 layers, down to 3 mil traces / spaces, 6 mil drilled holes. MIL-P-55110 approved for FR-4, polyimide, PTFE, epoxy Thermount(tm). Copper Sealed Vias are available. Deliveries down to 24 hours are available.
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
New Equipment | Test Equipment
Available Test Fixture Features: • Bed of nails • Clamshell Fixtures • Precisely installed pogo pins, guide pins, drilled holes and spacers. • Press down actuated / clamshell fixturing • Dual well and single well • Vacuum actuated • Custom Fixture de
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
Industry Directory | Media / Publisher / Online Resource
An international scientific journal published jointly by the Union of Metallurgy, Mining Industry and Geology of Slovak Republic, the Institute of Geotechnics of the Slovak Academy of Sciences.
