Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production
Ultra-high accuracy screen printing Panasonic's SP70 screen printer is designed for both high- and low-volume manufacturers who require ultra-high printing accuracy. PCBs up to 580 x 508mm are processed in a smaller footprint than previous SP-serie
Electronics Forum | Fri Apr 30 07:39:54 EDT 2010 | jdengler
We do a similar part on a Fuji IP3. Set table speed to low. I do not know the QP, but if it's similar to the IP make sure the board clamp/unclamp is smooth. On our IP it got dirty and was jerking causing the board to jump a little which bounced ou
Electronics Forum | Wed May 05 15:27:06 EDT 2010 | bradlanger
Make sure that both lead frames are contacting the PCB pads when the part is on the placement head. We had an SM xfrmer that we were handling with vacuum by a ferrite cap that was not glued on straight. The part would contact one set of pads and get
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards.
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
stress alone is not solely caused by differences in c
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2017-03-06
,” said Keith Wheeler, business unit director for fluid coating systems. “Besides being more accurate and user-friendly, the new design for multi-layer dies eliminates the cause of lip misalignment and helps to prevent the costly damage to both die and roll that can result
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. Solder Balling As its name suggests, solder balling happens when tiny ball-like particles appear on the board. Much like solder bridges, solder balls could cause electrical disruptions, especially those big enough to connect two conductors
