Industry Directory | Manufacturer
Our company is involved in the manufacturing of Miniaturized High Voltage Power Supplies.
Industry Directory | Manufacturer
Ultra Miniaturization Design and SMT Line to develop Unmanned Aerial Systems, Avionics and Payloads
New Equipment | Rework & Repair Equipment
Angled Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Angled Flat Reamer: SH-20D Tools with the Standard Angled Flat Reamer: SH-20B Applications 30 degree bend at the tip allows access to more difficult areas. Us
New Equipment | Rework & Repair Equipment
Standard Flat Reamer/Straight Fork Tip (SH-20A) (5 1/2") Description: Straight Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Straight Flat Reamer: SH-20C, SH-20E Tools with the Standard Straight Flat Reamer: SH
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-speed SMT(best conditions) 16200 CPH (grain per hour)
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XGP High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-speed SMT(best conditions) 16200 CPH (grain per hour)
Industry News | 2024-05-21 13:21:33.0
GPD Global, a leader in precision fluid dispensing systems, is proud to announce their successful participation at IPC APEX 2024 in Anaheim, California. This premier event in the electronics manufacturing industry was the stage for GPD Global to showcase their cutting-edge technology and live demonstrations of their state-of-the-art equipment.
Industry News | 2003-03-14 09:03:48.0
Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2017-06-13 13:28:22.0
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are some of the components that must be assembled to enable these portable electronic devices. It is widely accepted that about 65% of all end of the line defects occur in the stencil printing process. Given all of the above, it is critical that a precision stencil printing process be developed to support miniaturized electronic assembly.This paper is a summary of a significant amount of experimental data and process optimization techniques that were employed to establish a precision SMT printing process.
QYSMT MOREL Fully automatic nozzle cleaning machine-XMN-30 During the SMT process, the nozzle is easy to stick to solder paste or dirt, etc. If it is not maintained for a long time or the cleaning is not thorough during maintenance, the solder past
Our most advanced dispensing platform for electronics manufacturing The Vantage® Series is specifically designed for high-end advanced semiconductor package, electromechanical, and printed circuit board assembly. Create an unparalleled dispensing p
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 25 18:30:00 UTC 2024 - Mon Mar 25 18:30:00 UTC 2024 | Peoria,
Ultra High Density Interconnect Conference
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSEE a must, MSEE optional, 7+ yrs experience in RF wireless systems, preferably in a commercial enviornment. Duties/Functions: Provide technicl of customer requirements to the optimized of miniaturized RF/Wireless modules. Utili
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | San Jose, California USA | Engineering,Management,Research and Development
Ph.D., MBA, senior technical & management experience, advanced technology, electronics manufacturing processes, packaging, miniaturization, reliability, global team, PWB assembly, soldering Experience: 2001 - Flextronics, San Jose, CA Senior Manage
Career Center | San Jose, California USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
7044 Elmsdale Drive, San Jose, CA 95120 Phone: (408) 323 8971 E-Mail: DShangguan@Yahoo.Com Key Words: Ph.D., MBA, technical & management experience, advanced technology, electronics manufacturing processes, packaging, miniaturization, reliability, g
SMTnet Express, August 14, 2014, Subscribers: 23098, Members: Companies: 13988, Users: 36651 Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization. Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto; i3
Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Though designing much smaller packages presents its own unique set of hurdles (a topic
Imagineering, Inc. | https://www.pcbnet.com/blog/category/blog/page/5/
– with the push towards miniaturization and faster production speeds, solder bridge defects are an extremely problematic road bump that have become
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