Industry Directory | Distributor
WINSOURCE-Leading Electronic Components Distributor | Online Store
Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
New Equipment | Rework & Repair Equipment
Standard Flat Reamer/Straight Fork Tip (SH-20A) (8") Description: Straight Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Straight Flat Reamer: SH-20C, SH-20E Tools with the Standard Straight Flat Reamer: SH-20A
Used SMT Equipment | In-Circuit Testers
Features: Including Windows 7 Pro OS Large board ability to accept up to 25"W x 26"L boards Four topside moving probes IC Opens TOS4 Inspection (2) adjustable bottoside probes
Used SMT Equipment | In-Circuit Testers
2006 Seica Strategy In-Circuit Tester Power: 110V; 60Hz Note: The system passes all system diagnostics. It will be licensed and supported by Seica. Features: O/S: Windows 7 960 Analog Channels Open IC Pin Detection Manual Bar Code R
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-02-17 08:21:41.0
HDI Sales Made Up Larger Share of Net Sales in 4Q
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Sep 07 18:30:00 UTC 2020 - Mon Sep 07 18:30:00 UTC 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Events Calendar | Mon Mar 25 18:30:00 UTC 2024 - Mon Mar 25 18:30:00 UTC 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Career Center | San Jose/San Fran, California USA | Engineering
Our client, is a forerunner in high temperature semiconductor technology, seeks an Analog IC Design Engineer for their site in CA to work on product definition and designing Mixed Signal ICs. Established experience required in Analog & Mixed Signa
Career Center | Atlanta, Georgia USA | Purchasing
Our client has immediate need for a Purchasing Manager. Firm manufacturers electronics; PCB's, IC's. BS and/or experience. Location is mid-South.
Career Center | Binan, Laguna, Philippines | Maintenance
I have 13 yrs. of experience in handling different assembly equipment from IC manufacturing to SMT assembly.
Career Center | Cabuyao, PHILIPPINES Philippines | Maintenance,Production,Sales/Marketing,Technical Support
- Experience running automated SMT placement equipment. The operation, preventive maintenance and process assurance of a SMT manufacturing line. - Repairs major equipment breakdown/malfunction of modular and turret SMT machine. - Implements rou
3D ICs With TSVs - Design Challenges And Requirements 3D ICs With TSVs - Design Challenges And Requirements As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/information/ics-university-mailing-list
ICS University Mailing List Industrial Coating Systems Corporate | Global Directory | Languages Division Only All of Nordson Application Solutions Powder Coating Liquid Painting Container Coating Sealant Adhesive Systems Automotive Assembly UV Curing Systems Industries Aerospace Agriculture
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
