Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
The DV-07 is a normally closed, air-actuated diaphragm valve The DV-07 dispenses low to medium viscosity fluids for a variety of applications from microdots to volume fill. The DV-07 valve tolerates aggressive fluid formulations including acid-
New Equipment | Solder Paste Mixers
SMT Solder Paste Mixer SMT Solder Paste Mixer Solder Paste Mixer flux Solder Paste Mixer Product description: SMT Solder Paste Mixer-Good Price! Good Quality! Good Service! INQUIRY SMT Solder Paste Mixer Products description
Used SMT Equipment | Soldering Equipment/Fluxes
Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Technical Library | 2007-08-09 12:23:10.0
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
EMST Stallion PLC TT-JW is a new table top wave soldering machine from EMS Technologies, the soldering specialists. After the world wide success of the previous table top model, EMST Stallion, it is upgraded from manual controls to PLC based control
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-faqs
Solder Paste and Flux Frequently Asked Questions | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Finally, ensure that you are not mixing old and new flux, and that the flux you are using has not expired. Stencil – When a stencil is not properly cleaned, residue can accumulate and result in solder bridging defects in subsequent printings
