New Equipment | Education/Training
This latest version D of the IPC-A-610 released in Released February 2005, Presented in a one day class this is a must for all quality assurance and assembly departments. IPC-A-610D illustrates industry-accepted workmanship criteria for electronic
INSIL corporation provides various design services in the domains of VLSI. We accept outsourcing design services. some of the services include PCB design, board design, high speed design, networking board design, Reference board design. We have exper
Electronics Forum | Mon Jan 26 11:58:06 EST 2009 | ghcarnu
Hi there, where can I find some hints about placing the temperature sensors on the pcb when determining the reflow profile? I'm interested especially in the case of a pcb having BGA's. Thanks for your answers ! gheorghe
Electronics Forum | Wed Jan 28 08:56:40 EST 2009 | blnorman
Don't know the specifics from the IPC spec. However our standard internal spec dictates - highest thermal mass, lowest thermal, most critical component, and center of PCB on the laminate surface. Our profilers have 6 inputs, so the other 2 are dete
Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Industry News | 2018-10-18 09:56:07.0
What are the Factors Affecting the Cost of PCB Production?
Parts & Supplies | Pick and Place/Feeders
KH4-M655F-20X DS4R out of the board Sensor YAMAHA YV100II Chip Mounter KGA-M928A-00X SENSOR , LOW 1 L=1150 KGA-M928B-00X SENSOR , UP 1 L=1150 KGA-M927A-00X SENSOR , UP KGA-M927B-00X SENSOR , LOW KGA-M928A-00X SENSOR,LOW KGA-M928B-00X SENS
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2021-08-11 00:55:44.0
In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Tue Feb 14 16:00:00 EST 2017 - Tue Feb 14 16:30:00 EST 2017 | San Diego, California USA
Invited Speaker at APEX 2017 - Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Front Page THE LABORATORY A PRIMARY EVALUATION AND QUALIFICATION FACTOR TO DETERMINE PCB SUPPLIER PROCESS CAPABILITIES Earl
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
The Role of PCB Assembly in the Internet of Things (IoT) Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/silkscreen-outside-of-the-courtyard_topic648.html
Silkscreen Outside of the Courtyard - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Silkscreen Outside of the Courtyard
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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