Used SMT Equipment | SMT Equipment
Product name: KE - 2070 high-speed chip mounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placement machine of small components. Not only the element corresponding to a wide range of laser recogniti
Used SMT Equipment | SMT Equipment
Product name: KE - 2080 high-speed chip mounter Product number: KE - 2080 Detailed product introduction Characteristic： Small components of high speed SMT capacity and IC or complex shape abnormity components of high precision SMT ability and g
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive
Used SMT Equipment | SMT Equipment
Product name: KE - 3020 va/VRA general placement machine at a high speed Product number: KE - 3020 va/VRA Detailed product introduction Constantly improve the KE series products. So as to realize the high speed high quality electric production
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Used SMT Equipment | Chipshooters / Chip Mounters
BM231 NM-MF13 Panasonic placement machine BM231 parameter: Speed: 0.25S, Loading racks: 60 (double-tape racks 120) pallet 80 stations Component type: 0603-55mm Power supply: 3P/200V/8, Dimensions: 1950/2060/1500mm Weight: 2000kg Suitable c
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100X parameters Substrate size ATS20 (end orientation) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed 100 kinds (8MM) Board transfer direction right-left Mounting accuracy ±0.1m
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Used SMT Equipment | Assembly Accessories
Panasonic's BM231 modular high speed multi-functional placement machine boasts any volume, any mix capability by placing a wide array of components from 0402 (01005) microchips to BGA's, CSP's and connectors. Outstanding productivity is a
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
