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High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address the challenges presented by evolving technologies, stencil suppliers have provided a variety of options in stencil technology, including new foil materials, manufacturing processes and coatings.
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Authors: |
Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat, Jeff Ando, Paul Hashimoto |
Organization: |
Shea Engineering Services, Beam On Technology, Jabil |
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