This work aimed to characterize the deportment/concentration and liberation/association of the metals and light elements within mechanically processed waste printed circuit boards (PCBs) that hold the complex and heterogeneous structure and distribution of different material components. Waste PCBs passed through a series of mechanical processing (i.e., comminution and sieving) for metal recovery and were then characterized without further destroying the particles in order to capture their heterogeneity. The characterizations were performed in a laboratory and large-scale neutron facility.
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.
First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information ...
After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early....
Counterfeit products have been a growing problem worldwide, and the electronics industry has been no exception. Authentication of electronic components by electrical and physical testing can provide a cost-effective means of risk management, aimed at keeping counterfeits out of the supply chain. In this presentation, we will review sources of counterfeit components, and discuss the capabilities and limitations of test processes used for authentication. We will then present examples of component authentication using these tools.
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
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Wisdom Electronics Co,LTD. - Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.
Integrated Nut And Bolt - Integrated Bolt and Nut is a premier purchasing platform offering access to over 2 billion ready-to-ship fasteners like bolts, screws, nuts, anchors, and more
n the dynamic world of electronics manufacturing, Electronic Manufacturing Services (EMS) providers play a crucial role in bringing innovative ideas to life. I.C.T , a leading provider of smart factory solutions, recognizes the critical importance of technical support in empowering EMS ...
The SMTA is pleased to announce the technical program for the Counterfeit Parts & Materials Symposium. Co-organized by SMTA and the Center for Advanced Life Cycle Engineering (CALCE), the event will be held June 25 to 27, 2024 in Hyattsville, Maryland at the College Park Marriott Conference Center....
Kurtz Ersa Inc. is excited to announce its participation in EPTECH Vancouver 2024, taking place Tuesday, June 4, 2024 at the Delta Hotels by Marriott Burnaby Conference Centre. Joining forces with trusted partner Comtree, representatives from both companies will be available to engage with attendees and showcase Ersa's comprehensive range of cutting-edge solutions....
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.