SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25^th, 2018.

The demand for electro-mobility technologies and solutions within the automotive industry has rapidly increased with the emergence of electric and autonomous vehicles. These applications expose the electronics to higher voltages. Kerstin Lux, a Ph.D. candidate from Bosch, will present on humidity induced failure mechanisms on electronics during high voltage load. Ms. Lux will present research that investigated the behavior of PCBs built with different material sets under high-voltage and high humidity load conditions. A model of the electrochemical reactions under high voltage and humidity conditions will be presented.

High power LED and automotive electronics must endure high temperature, thermal stresses, vibration and other harsh conditions. Dr. Maalekian of AIM Solder will present on improved solder alloy reliability and mechanical stability using micro-applying elements. The research from this work find that the addition of micro alloying dopants reduce the alloys temperature gradient’s while improving thermal fatigue and reliability.

When exposed to high temperatures stresses, there is the potential for solder alloy cracking and delamination. Graham Wilson of Indium Corporation will present on solder printed over a metal mesh preform to increase the reliability between the substrate and baseplate within IGBT Modules. The research finds that increased standoff improves the homogenous solder layer. Mr. Wilson will present research findings that improve solder reliability and overcome thermal fatigue and solder delamination.