SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Mar 12, 2018

DA-6010 Non-Conductive Die Attach Adhesive.

DA-6010 Non-Conductive Die Attach Adhesive.

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.

EMS DA-6010 has a moderate glass transition temperature (Tg) and modulus. With an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, DA-6010 is designed to adhere to both flexible and rigid substrates.

DA-6010 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the DA-6010 Non-Conductive Die Attach Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Mar 08, 2018 -

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Jan 28, 2018 -

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018 -

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

56 more news from Engineered Materials Systems, Inc. »

Apr 19, 2018 -

ULT LLC cooperates with GulfTech

Apr 18, 2018 -

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 18, 2018 -

IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2018 in Paris

Apr 18, 2018 -

Koh Young Presenting on 3D Technologies at SMTA Rocky Mountain Chapter Technical Session

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 17, 2018 -

Seika Announces Plans for Optimized Drying Units to be Incorporated into all McDry Cabinets

Apr 17, 2018 -

Libra Industries Sponsors SMTA Ohio Valley Membership Appreciation Golf Outing

Apr 17, 2018 -

Preview for AdoptSMT for SMT 2018, Stand A4-458 We keep your production running -

Apr 17, 2018 -

cost saving SMT laser cut stencil

See electronics manufacturing industry news »

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications news release has been viewed 193 times

  • SMTnet
  • »
  • Industry News
  • »
  • New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications
Used SMT Equipment

FPC* - Fluid Pressure Control - Dispensing Pump