Dam and Fill Encapsulation for Microelectronic Packages
Published: |
August 27, 1999 |
Author: |
Steven J. Adamson and Christian Q. Ness |
Abstract: |
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...... |
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