Electronics Forum | Wed Nov 14 04:36:33 EST 2018 | components
2 article may help you sort: https://www.allchips.ai/blog/electronics-forum-and-community-for-engineers 13 Electronics forum and community for engineers https://www.allchips.ai/blog/10-electronic-components-news-websites 10 Electronic Components New
Electronics Forum | Tue Sep 19 14:25:31 EDT 2000 | lcaliber
What kind of problems or heat realted issues will I have with components that are near the actual rework sites?
Electronics Forum | Tue Mar 06 18:34:59 EST 2007 | GS
It may be to much solder paste under components. Try different paste doposit schape or thikness Regards....GS
Electronics Forum | Wed Mar 07 07:21:08 EST 2007 | jdengler
We window pane the heat sink pad to reduce the amount of paste for DPACK component
Electronics Forum | Wed May 27 04:45:48 EDT 2009 | mun4o
all components ar on the top side... regards
Electronics Forum | Wed May 27 08:03:39 EDT 2009 | davef
Please describe the break in the components. Attaching pictures would be helpful.
Electronics Forum | Tue Apr 24 13:48:37 EDT 2001 | CAL
I would look at the pad to part ratio.Over sized pad geometry will give the component more room to move. I have also seen where the two pads that make up chip components are not symetrical nor complimentary.The pads should be equal in the X or Y dire
Electronics Forum | Sun Sep 25 16:02:59 EDT 2005 | mark
The calibration was ok. When i switch off the back camera and use front one everything is ok. Is it true that when Topaz use back line camera after checking the components the machine rotates the components 180 degree?. Mark \
Electronics Forum | Thu Aug 03 12:51:20 EDT 2006 | Ofer Cohen
I'd appreciate your support in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT co
Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen
I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen
